J. S. Hwang

According to our database, J. S. Hwang authored at least 5 papers between 1992 and 2012.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2012

Effect of EFO parameters and superimposed ultrasound on work hardening behavior of palladium coated copper wire in thermosonic ball bonding.

Wan Ho Song, Michael Mayer, Norman Y. Zhou, S. H. Kim, J. S. Hwang, J. T. Moon

Microelectron. Reliab., 2012

2008

Effects of bonding temperature on the properties and reliabilities of anisotropic conductive films (ACFs) for flip chip on organic substrate application.

J. S. Hwang, M. J. Yim, K. W. Paik

Microelectron. Reliab., 2008

Filler size and content effects on the composite properties of anisotropic conductive films (ACFs) and reliability of flip chip assembly using ACFs.

J. S. Hwang

Microelectron. Reliab., 2008

1999

Rational approximation to orthogonal bases and of the solutions of elliptic equations.

J. S. Hwang

Numerische Mathematik, 1999

1992

Interference-free tool-path generation in the NC machining of parametric compound surfaces.

J. S. Hwang

Comput. Aided Des., 1992