J. R. Lloyd

According to our database, J. R. Lloyd authored at least 8 papers between 2004 and 2024.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2024

A Novel Method for the Determination of Electromigration-Induced Void Nucleation Stresses.

J. Shuster-Passage, S. Abdel Razek, M. Mattoo, Meike Hauschildt, Seungman Choi, Martin Gall, Armen Kteyan, Jun-Ho Choy, Valeriy Sukharev, Matthias Kraatz, J. R. Lloyd

Proceedings of the IEEE International Reliability Physics Symposium, 2024

2019

Stress Migration Followed by Electromigration Reliability Testing.

J. M. Passage, Nabihah Azhari, J. R. Lloyd

Proceedings of the IEEE International Reliability Physics Symposium, 2019

Comparative Study of TDDB Models on BEOL Interconnects for Sub-20 nm Spacings.

Niaz Mahmud, Nabihah Azhari, J. R. Lloyd

Proceedings of the IEEE International Reliability Physics Symposium, 2019

2010

Fast diffusers in a thermal gradient (solder ball).

J. R. Lloyd, N. A. Connelly, Xiaoli He, K. J. Ryan, B. H. Wood

Microelectron. Reliab., 2010

2007

Black's law revisited - Nucleation and growth in electromigration failure.

J. R. Lloyd

Microelectron. Reliab., 2007

2006

The effect of Cu diffusion on the TDDB behavior in a low-k interlevel dielectrics.

J. R. Lloyd, C. E. Murray, S. Ponoth, S. Cohen, E. Liniger

Microelectron. Reliab., 2006

2004

Reliability Challenges with Ultra-Low k Interlevel Dielectrics.

J. R. Lloyd, M. R. Lane, X.-H. Liu, E. Liniger, T. M. Shaw, C.-K. Hu, R. Rosenberg

Microelectron. Reliab., 2004

Time dependent dielectric breakdown in a low-k interlevel dielectric.

J. R. Lloyd, E. Liniger, S. T. Chen

Microelectron. Reliab., 2004