J. P. Rebrasse

According to our database, J. P. Rebrasse authored at least 4 papers between 2007 and 2010.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2010

Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing.

A. Aubert, J. P. Rebrasse, Lionel Dantas de Morais, Nathalie Labat, Hélène Frémont

Microelectron. Reliab., 2010

2008

Laser decapsulation of plastic packages for failure analysis: Process control and artefact investigations.

A. Aubert, Lionel Dantas de Morais, J. P. Rebrasse

Microelectron. Reliab., 2008

2007

Thermal approach of defects generation on copper/organic dielectric interface due to SEM inspections.

Lionel Dantas de Morais, F. Allanic, F. Roqueta, J. P. Rebrasse

Microelectron. Reliab., 2007

Localization of sensitive areas of power AC switch under thermal laser stimulation.

S. Debleds, J. P. Rebrasse, Lionel Dantas de Morais, I. Frapreau, R. Perdreau, B. Morillon

Microelectron. Reliab., 2007