J. Moore
This page is a disambiguation page, it actually contains mutiple papers from persons of the same or a similar name.
Bibliography
2009
A review of wafer bonding materials and characterizations to enable wafer thinning, backside processing, and laser dicing.
Proceedings of the IEEE International Conference on 3D System Integration, 2009
2002
1995
Panel Languages and Models for Reusable Components.
Proceedings of the ACM SIGSOFT Symposium on Software Reusability, 1995
1986
Operating System Support on a RISC.
Proceedings of the Spring COMPCON'86, 1986
1981
1977