J. K. Shang

According to our database, J. K. Shang authored at least 2 papers between 2011 and 2013.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2013

Ex situ observations of fast intermetallic growth on the surface of interfacial region between eutectic SnBi solder and Cu substrate during solid-state aging process.

P. J. Shang, L. Zhang, Zhi-Quan Liu, J. Tan, J. K. Shang

Microelectron. Reliab., 2013

2011

Effects of Bi segregation on the tensile properties of Cu/Cu₃Sn(1 0 0) interface.

X. Y. Pang, Zhi-Quan Liu, S. Q. Wang, J. K. Shang

Microelectron. Reliab., 2011