J. D. Wu

According to our database, J. D. Wu authored at least 6 papers between 2001 and 2006.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2006

A study in flip-chip UBM/bump reliability with effects of SnPb solder composition.

J. D. Wu, P. J. Zheng, C. W. Lee, S. C. Hung, J. J. Lee

Microelectron. Reliab., 2006

Effects of pre-bump probing and bumping processes on eutectic solder bump electromigration.

Kuo-Ming Chen, J. D. Wu, Kuo-Ning Chiang

Microelectron. Reliab., 2006

2003

Solder joint reliability of TFBGA assemblies with fresh and reworked solder balls.

Po-Jen Zheng, J. Z. Lee, K. H. Liu, J. D. Wu, S. C. Hung

Microelectron. Reliab., 2003

Fracture strength characterization and failure analysis of silicon dies.

J. D. Wu, C. Y. Huang, C. C. Liao

Microelectron. Reliab., 2003

2002

Board level reliability of a stacked CSP subjected to cyclic bending.

J. D. Wu, S. H. Ho, C. Y. Huang, C. C. Liao, P. J. Zheng, S. C. Hung

Microelectron. Reliab., 2002

2001

Board level reliability of PBGA using flex substrate.

S. C. Hung, P. J. Zheng, S. H. Ho, S. C. Lee, H. N. Chen, J. D. Wu

Microelectron. Reliab., 2001