Ivan Ciofi

Orcid: 0000-0003-1374-4116

According to our database1, Ivan Ciofi authored at least 21 papers between 2000 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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On csauthors.net:

Bibliography

2024
Mitigating Line-Break Defectivity with a Sandwiched TiN or W Layer for Metal Pitch 18 NM Aspect Ratio 6 Semi-Damascene Interconnects.
Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

Exploring the Reliability Limits for the Z-Pitch Scaling of Molybdenum Inter-Word Line Oxides in 3D NAND.
Proceedings of the IEEE International Reliability Physics Symposium, 2024

De-Coupling Thermo-Migration from Electromigration Using a Dedicated Test Structure.
Proceedings of the IEEE International Reliability Physics Symposium, 2024

BEOL tip-to-tip dielectric reliability characterization using a design-representative test structure.
Proceedings of the IEEE International Reliability Physics Symposium, 2024

2023
Block-level Evaluation and Optimization of Backside PDN for High-Performance Computing at the A14 node.
Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

Challenges for Interconnect Reliability: From Element to System Level.
Proceedings of the 2023 International Symposium on Physical Design, 2023

A pragmatic network-aware paradigm for system-level electromigration predictions at scale.
Proceedings of the IEEE International Reliability Physics Symposium, 2023

Towards accurate temperature prediction in BEOL for reliability assessment (Invited).
Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022
System-Level Simulation of Electromigration in a 3 nm CMOS Power Delivery Network: The Effect of Grid Redundancy, Metallization Stack and Standard-Cell Currents.
Proceedings of the IEEE International Reliability Physics Symposium, 2022

Assessment of critical Co electromigration parameters.
Proceedings of the IEEE International Reliability Physics Symposium, 2022

2021
A Novel System-Level Physics-Based Electromigration Modelling Framework: Application to the Power Delivery Network.
Proceedings of the ACM/IEEE International Workshop on System Level Interconnect Prediction, 2021

2018
Insights into metal drift induced failure in MOL and BEOL.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

Method to assess the impact of LER and spacing variation on BEOL dielectric reliability using 2D-field simulations for <20nm spacing.
Proceedings of the IEEE International Reliability Physics Symposium, 2018

2017
LER and spacing variability on BEOL TDDB using E-field mapping: Impact of field acceleration.
Microelectron. Reliab., 2017

2016
Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation.
Microelectron. Reliab., 2016

2015
Intrinsic reliability of local interconnects for N7 and beyond.
Proceedings of the IEEE International Reliability Physics Symposium, 2015

Impact of process variability on BEOL TDDB lifetime model assessment.
Proceedings of the IEEE International Reliability Physics Symposium, 2015

2014
Circuit and process co-design with vertical gate-all-around nanowire FET technology to extend CMOS scaling for 5nm and beyond technologies.
Proceedings of the 44th European Solid State Device Research Conference, 2014

2012
Methodology for extracting the characteristic capacitances of a power MOSFET transistor, using conventional on-wafer testing techniques.
Proceedings of the 2012 European Solid-State Device Research Conference, 2012

2001
Metodi e strumentazione per la caratterizzazione di interconnessioni VLSI.
PhD thesis, 2001

2000
Temperature controlled oven for low noise measurement systems [for electromigration characterization].
IEEE Trans. Instrum. Meas., 2000


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