Irfan Anjum Badruddin

Orcid: 0000-0002-2247-7999

According to our database1, Irfan Anjum Badruddin authored at least 14 papers between 2012 and 2021.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

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PhD thesis 
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Online presence:

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Bibliography

2021
Heat Transfer and Entropy in a Vertical Porous Plate Subjected to Suction Velocity and MHD.
Entropy, 2021

2020
Super Stability of Ag Nanoparticle in Crystalline Lamellar (Lc) Liquid Crystal Matrix at Different pH Environment.
Symmetry, 2020

Multi-Scale Study on Mechanical Property and Strength of New Green Sand (Poly Lactic Acid) as Replacement of Fine Aggregate in Concrete Mix.
Symmetry, 2020

Effect of Zinc Oxide Nano-Additives and Soybean Biodiesel at Varying Loads and Compression Ratios on VCR Diesel Engine Characteristics.
Symmetry, 2020

Computational fluid dynamics modelling of human upper airway: A review.
Comput. Methods Programs Biomed., 2020

Finite element analysis of immature teeth filled with MTA, Biodentine and Bioaggregate.
Comput. Methods Programs Biomed., 2020

2019
Investigation on Surface Properties of Mn-Doped CdSe Quantum Dots Studied by X-ray Photoelectron Spectroscopy.
Symmetry, 2019

Extraction of Cellulose Nano-Whiskers Using Ionic Liquid-Assisted Ultra-Sonication: Optimization and Mathematical Modelling Using Box-Behnken Design.
Symmetry, 2019

A review of fluid-structure interaction simulation for patients with sleep related breathing disorders with obstructive sleep.
Comput. Methods Programs Biomed., 2019

2017
Patient-specific 3D hemodynamics modelling of left coronary artery under hyperemic conditions.
Medical Biol. Eng. Comput., 2017

2015
The effect of iron and bismuth addition on the microstructural, mechanical, and thermal properties of Sn-1Ag-0.5Cu solder alloy.
Microelectron. Reliab., 2015

2013
Hierarchical congregated ant system for bottom-up VLSI placements.
Eng. Appl. Artif. Intell., 2013

2012
Novel Fe-containing Sn-1Ag-0.5Cu lead-free solder alloy with further enhanced elastic compliance and plastic energy dissipation ability for mobile products.
Microelectron. Reliab., 2012

A review on thermal cycling and drop impact reliability of SAC solder joint in portable electronic products.
Microelectron. Reliab., 2012


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