Imed Jani

According to our database, Imed Jani authored at least 5 papers between 2017 and 2019.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2019

Test Solutions for High Density 3D-IC Interconnects - Focus on SRAM-on-Logic Partitioning.

Imed Jani, Didier Lattard, Pascal Vivet, Jean Durupt, Sébastien Thuries, Edith Beigné

Proceedings of the 24th IEEE European Test Symposium, 2019

Misalignment Analysis and Electrical Performance of High Density 3D-IC interconnects.

Imed Jani, Didier Lattard, Pascal Vivet, Lucile Arnaud, Edith Beigné

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2018

Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability.

Lucile Arnaud, Stéphane Moreau, Amadine Jouve, Imed Jani, Didier Lattard, F. Fournel, C. Euvrard, Y. Exbrayat, Viorel Balan, Nicolas Bresson, S. Lhostis, J. Jourdon, E. Deloffre, S. Guillaumet, Alexis Farcy, Simon Gousseau, M. Arnoux

Proceedings of the IEEE International Reliability Physics Symposium, 2018

BISTs for post-bond test and electrical analysis of high density 3D interconnect defects.

Imed Jani, Didier Lattard, Pascal Vivet, Lucile Arnaud, Edith Beigné

Proceedings of the 23rd IEEE European Test Symposium, 2018

2017

Innovative structures to test bonding alignment and characterize high density interconnects in 3D-IC.

Imed Jani, Didier Lattard, Pascal Vivet, Edith Beigné

Proceedings of the 15th IEEE International New Circuits and Systems Conference, 2017