Ikuo Ohnuma

Orcid: 0000-0003-4874-4941

According to our database1, Ikuo Ohnuma authored at least 2 papers between 2006 and 2007.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2007
Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device.
Microelectron. Reliab., 2007

2006
Pb-free high temperature solders for power device packaging.
Microelectron. Reliab., 2006


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