I-chen Ho

According to our database1, I-chen Ho authored at least 1 paper in 2020.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Links

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Bibliography

2020
Silicon Reliability Characterization of Intel's Foveros 3D Integration Technology for Logic-on-Logic Die Stacking.
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020


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