Hyunsu Chae
Orcid: 0000-0001-9266-555X
According to our database1,
Hyunsu Chae
authored at least 10 papers
between 2004 and 2025.
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Bibliography
2025
Proceedings of the 30th Asia and South Pacific Design Automation Conference, 2025
2024
ISOP+: Machine Learning-Assisted Inverse Stack-Up Optimization for Advanced Package Design.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., January, 2024
A 4-nm 16-Gb/s/pin Single-Ended PAM-4 Parallel Transceiver With Switching-Jitter Compensation and Transmitter Optimization.
IEEE J. Solid State Circuits, January, 2024
ISOP-Yield: Yield-Aware Stack-Up Optimization for Advanced Package using Machine Learning.
Proceedings of the 29th Asia and South Pacific Design Automation Conference, 2024
2023
A 4nm 16Gb/s/pin Single-Ended PAM4 Parallel Transceiver with Switching-Jitter Compensation and Transmitter Optimization.
Proceedings of the IEEE International Solid- State Circuits Conference, 2023
2022
A 64Gb/s Downlink and 32Gb/s Uplink NRZ Wireline Transceiver with Supply Regulation, Background Clock Correction and EOM-based Channel Adaptation for Mid-Reach Cellular Mobile Interface in 8nm FinFET.
Proceedings of the 48th IEEE European Solid State Circuits Conference, 2022
2018
Test cost reduction for <i>X</i>-value elimination by scan slice correlation analysis.
Proceedings of the 55th Annual Design Automation Conference, 2018
2005
Proceedings of the 2nd IEEE International Symposium on Wireless Communication Systems, 2005
2004
Proceedings of the Proceedings 2004 IEEE International SOC Conference, 2004
Proceedings of the IEEE 2004 Custom Integrated Circuits Conference, 2004