Hyun-Chul Sagong
Orcid: 0009-0003-0236-6698Affiliations:
- Samsung, South Korea
According to our database1,
Hyun-Chul Sagong
authored at least 14 papers
between 2015 and 2024.
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Bibliography
2024
Analysis of Failure Mechanism and Reliability Enhancement of Silicon Strain Gauge-Based Pressure Sensor for Automotive Applications.
Sensors, February, 2024
IEEE Access, 2024
IEEE Access, 2024
2023
Prediction of Internal Temperature of Starter Solenoid Via PoF-Based Fault Reproduction Experiment.
IEEE Trans. Instrum. Meas., 2023
2021
Proceedings of the IEEE International Reliability Physics Symposium, 2021
Time Dependent Variability in Advanced FinFET Technology for End-of-Lifetime Reliability Prediction.
Proceedings of the IEEE International Reliability Physics Symposium, 2021
2020
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020
Advanced Self-heating Model and Methodology for Layout Proximity Effect in FinFET Technology.
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020
2019
Localized Layout Effect Related Reliability Approach in 8nm FinFETs Technology: From Transistor to Circuit.
Proceedings of the IEEE International Reliability Physics Symposium, 2019
2018
Investigation of alpha-induced single event transient (SET) in 10 nm FinFET logic circuit.
Proceedings of the IEEE International Reliability Physics Symposium, 2018
Effects of Far-BEOL anneal on the WLR and product reliability characterization of FinFET process technology.
Proceedings of the IEEE International Reliability Physics Symposium, 2018
Proceedings of the IEEE International Reliability Physics Symposium, 2018
Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI.
Proceedings of the IEEE International Reliability Physics Symposium, 2018
2015
Systematical study of 14nm FinFET reliability: From device level stress to product HTOL.
Proceedings of the IEEE International Reliability Physics Symposium, 2015