Hyun-Cheol Bae

According to our database, Hyun-Cheol Bae authored at least 5 papers between 2013 and 2017.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2017

Evaluating the material properties of underfill for a reliable 3D TSV integration package using numerical analysis.

Hyungseok Yoon, Kwang-Seong Choi, Hyun-Cheol Bae, Jong-Tae Moon, Yong-Sung Eom, Insu Jeon

Microelectron. Reliab., 2017

2015

Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation.

Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

Fault detection and isolation of multiple defects in through silicon via (TSV) channel.

Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Sukjin Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Modeling and analysis of open defect in through silicon via (TSV) channel.

Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi

Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013

Fault isolation of short defect in through silicon via (TSV) based 3D-IC.

Daniel H. Jung, Jonghyun Cho, Heegon Kim, Jonghoon J. Kim, Hongseok Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013