Hyo-Soo Lee

According to our database, Hyo-Soo Lee authored at least 1 paper in 2008.

Collaborative distances:

• Dijkstra number of seven.
• Erdős number of six.

2008

Effects of isothermal aging and temperature-humidity treatment of substrate on joint reliability of Sn-3.0Ag-0.5Cu/OSP-finished Cu CSP solder joint.

Jeong-Won Yoon, Bo-In Noh, Young-Ho Lee, Hyo-Soo Lee, Seung-Boo Jung

Microelectron. Reliab., 2008