Hussin Kamarudin

According to our database, Hussin Kamarudin authored at least 6 papers in 2013.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of six.

2013

High Power LED Thermal and Stress Simulation on Copper Slug.

Rajendaran Vairavan, Zaliman Sauli, Vithyacharan Retnasamy, Rizalafande Che Ismail, Nurul Izza Mohd Nor, Nor Shakirina Nadzri, Hussin Kamarudin

Proceedings of the 15th International Conference on Computer Modelling and Simulation, 2013

Stress and Temperature Simulation Using Copper-Diamond Composite Slug.

Zaliman Sauli, Vithyacharan Retnasamy, Rajendaran Vairavan, Rizalafande Che Ismail, Nazuhusna Khalid, Mohd Fikri Che Husin, Hussin Kamarudin

Proceedings of the 15th International Conference on Computer Modelling and Simulation, 2013

Solid State Lighting Stress and Junction Temperature Evaluation on Operating Power.

Zaliman Sauli, Vithyacharan Retnasamy, Rajendaran Vairavan, Wan Mokhdzani Wan Nor Haimi, Hussin Kamarudin, Neoh Fung Yih, Nazuhusna Khalid

Proceedings of the 15th International Conference on Computer Modelling and Simulation, 2013

Shearing Speed Stress Comparison between Sn-3.9Ag-0.6Cu and Sn-3.5Ag-0.7Cu Solder Ball.

Zaliman Sauli, Vithyacharan Retnasamy, Ong Tee Say, Steven Taniselass, Rizalafande Che Ismail, Aaron Koay Terr Yeow, Hussin Kamarudin

Proceedings of the 15th International Conference on Computer Modelling and Simulation, 2013

Shear Height Analysis Study on Sn-3.9Ag-0.6Cu by Using SSF Method.

Zaliman Sauli, Vithyacharan Retnasamy, Muhamad Hafiz Ab Aziz, Ong Tee Say, Hussin Kamarudin, Dasarathan Rajan Theren, Bahari Man

Proceedings of the 15th International Conference on Computer Modelling and Simulation, 2013

Different Shear Height Stress Evaluation on -0.7Cu Based Lead Free Solder.

Vithyacharan Retnasamy, Zaliman Sauli, Nurul Izza Mohd Nor, Moganraj Palianysamy, Rizalafande Che Ismail, Ong Tee Say, Hussin Kamarudin

Proceedings of the 15th International Conference on Computer Modelling and Simulation, 2013