Hun Shen Ng

According to our database, Hun Shen Ng authored at least 6 papers between 2003 and 2010.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2010

Advanced analysis on board trace reliability of WLCSP under drop impact.

Ahmer Syed, Tong Yan Tee, Hun Shen Ng, Rex Anderson, Choong Peng Khoo, Boyd Rogers

Microelectron. Reliab., 2010

2006

Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA.

Tong Yan Tee, Hun Shen Ng, Zhaowei Zhong

Microelectron. Reliab., 2006

2004

Impact life prediction modeling of TFBGA packages under board level drop test.

Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim, Eric Pek, Zhaowei Zhong

Microelectron. Reliab., 2004

2003

Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages.

Tong Yan Tee, Hun Shen Ng, Daniel Yap, Zhaowei Zhong

Microelectron. Reliab., 2003

Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications.

Tong Yan Tee, Hun Shen Ng, Daniel Yap, Xavier Baraton, Zhaowei Zhong

Microelectron. Reliab., 2003

Design For Board Level Reliability Of A Miniaturized Mems Package: Stacked Die Tqfn.

Tong Yan Tee, Giovanni Frezza, Mayhuan Lim, Hun Shen Ng, Federico Ziglioli, Zhaowei Zhong

Int. J. Comput. Eng. Sci., 2003