Hui Pan
Orcid: 0000-0002-9682-1916Affiliations:
- Broadcom Corporation, Irvine, CA, USA
- University of California, Los Angeles, UCLA, ICSL, Electrical Engineering Department, Los Angeles, CA, USA (PhD 1999)
According to our database1,
Hui Pan
authored at least 11 papers
between 2000 and 2017.
Collaborative distances:
Collaborative distances:
Timeline
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Online presence:
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on orcid.org
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Bibliography
2017
Proceedings of the 2017 IEEE Custom Integrated Circuits Conference, 2017
2016
Proceedings of the 2016 IEEE International Solid-State Circuits Conference, 2016
2014
A Full-Duplex Line Driver for Gigabit Ethernet With Rail-to-Rail Class-AB Output Stage in 28 nm CMOS.
IEEE J. Solid State Circuits, 2014
8.6 A full-duplex line driver for Gigabit Ethernet with rail-to-rail class-AB output stage in 28nm CMOS.
Proceedings of the 2014 IEEE International Conference on Solid-State Circuits Conference, 2014
2011
Proceedings of the IEEE International Solid-State Circuits Conference, 2011
2010
A 500 mW ADC-Based CMOS AFE With Digital Calibration for 10 Gb/s Serial Links Over KR-Backplane and Multimode Fiber.
IEEE J. Solid State Circuits, 2010
2009
21.7 A 500mW digitally calibrated AFE in 65nm CMOS for 10Gb/s Serial links over backplane and multimode fiber.
Proceedings of the IEEE International Solid-State Circuits Conference, 2009
2004
IEEE Trans. Circuits Syst. I Regul. Pap., 2004
2003
IEEE Trans. Circuits Syst. II Express Briefs, 2003
2000
IEEE J. Solid State Circuits, 2000