Huan-Chun Fu

According to our database, Huan-Chun Fu authored at least 2 papers between 2010 and 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2013

Performance and process characteristic of glass interposer with through-glass-via(TGV).

Chun-Hsien Chien, Hsun Yu, Ching-Kuan Lee, Yu-Min Lin, Ren-Shin Cheng, Chau-Jie Zhan, Peng-Shu Chen, Chang-Chih Liu, Chao-Kai Hsu, Hsiang-Hung Chang, Huan-Chun Fu, Yuan-Chang Lee, Wen-Wei Shen, Cheng-Ta Ko, Wei-Chung Lo, Yung Jean Lu

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2010

Wafer-level 3D integration using hybrid bonding.

Cheng-Ta Ko, Kuan-Neng Chen, Wei-Chung Lo, Chuan-An Cheng, Wen-Chun Huang, Zhi-Cheng Hsiao, Huan-Chun Fu, Yu-Hua Chen

Proceedings of the IEEE International Conference on 3D System Integration, 2010