Hua Lu

According to our database, Hua Lu authored at least 12 papers between 2002 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2018

An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method.

Kenneth Chimezie Nwanoro, Hua Lu, Chunyan Yin, Chris Bailey

Microelectron. Reliab., 2018

2017

Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective.

Pushparajah Rajaguru, Hua Lu, Chris Bailey, Jose Angel Ortiz Gonzalez, Olayiwola Alatise

Microelectron. Reliab., 2017

2015

A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module.

Pushparajah Rajaguru, Hua Lu, Chris Bailey

Microelectron. Reliab., 2015

Sintered silver finite element modelling and reliability based design optimisation in power electronic module.

Pushparajah Rajaguru, Hua Lu, Chris Bailey

Microelectron. Reliab., 2015

False shares in verifiable secret sharing with finite field commitments.

Hua Lu, Jack Peterson

CoRR, 2015

2011

Integration of analytical techniques in stochastic optimization of microsystem reliability.

Xiangdong Xue, Chris Bailey, Hua Lu, Stoyan Stoyanov

Microelectron. Reliab., 2011

2010

A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects.

E. Kamara, Hua Lu, Chris Bailey, Chris Hunt, Davide Di Maio, Owen Thomas

Microelectron. Reliab., 2010

2009

Design for reliability of power electronics modules.

Hua Lu, Chris Bailey, Chunyan Yin

Microelectron. Reliab., 2009

2008

Failure mechanisms of ACF joints under isothermal ageing.

M. J. Rizvi, Chris Bailey, Hua Lu

Microelectron. J., 2008

2005

Study of anisotropic conductive adhesive joint behavior under 3-point bending.

M. J. Rizvi, Y. C. Chan, Chris Bailey, Hua Lu

Microelectron. Reliab., 2005

2003

The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications.

Chunyan Yin, M. O. Alam, Yan Cheong Chan, Chris Bailey, Hua Lu

Microelectron. Reliab., 2003

2002

No-flow underfill flip chip assembly--an experimental and modeling analysis.

Hua Lu, K. C. Hung, Stoyan Stoyanov, Chris Bailey, Y. C. Chan

Microelectron. Reliab., 2002