Hsin-En Cheng

According to our database¹, Hsin-En Cheng authored at least 2 papers between 2014 and 2015.

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2015

Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls.

[BibT_eX]

[DOI]

Qual. Reliab. Eng. Int., 2015

2014

Interval optimal design of 3-D TSV stacked chips package reliability by using the genetic algorithm method.

[BibT_eX]

[DOI]

Microelectron. Reliab., 2014