Hsien-Chie Cheng
According to our database1,
Hsien-Chie Cheng
authored at least 7 papers
between 2006 and 2016.
Collaborative distances:
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Bibliography
2016
Heat dissipation assessment of through silicon via (TSV)-based 3D IC packaging for CMOS image sensing.
Microelectron. Reliab., 2016
2013
IMC growth reaction and its effects on solder joint thermal cycling reliability of 3D chip stacking packaging.
Microelectron. Reliab., 2013
2012
Crystal size and direction dependence of the elastic properties of Cu<sub>3</sub>Sn through molecular dynamics simulation and nanoindentation testing.
Microelectron. Reliab., 2012
2011
Thermal-mechanical optimization of a novel nanocomposite-film typed flip chip technology.
Microelectron. Reliab., 2011
Modified Nosé-Hoover thermostat for solid state for constant temperature molecular dynamics simulation.
J. Comput. Phys., 2011
2010
Development of three-dimensional chip stacking technology using a clamped through-silicon via interconnection.
Microelectron. Reliab., 2010
2006
Adv. Eng. Softw., 2006