Hsiao-Tung Ku

According to our database, Hsiao-Tung Ku authored at least 2 papers between 2007 and 2008.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2008

The mechanical stress resistance capability of stress buffer structures in analog devices.

Hsiao-Tung Ku, Kuo-Ning Chiang

Microelectron. Reliab., 2008

2007

Solder joints layout design and reliability enhancements of wafer level packaging using response surface methodology.

Chang-Chun Lee, Chien-Chen Lee, Hsiao-Tung Ku, Shu-Ming Chang, Kuo-Ning Chiang

Microelectron. Reliab., 2007