Houping Wu

Orcid: 0000-0002-9019-7358

According to our database¹, Houping Wu authored at least 3 papers between 2022 and 2024.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of four.

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Bibliography

2024

Sub-Micrometer Resolution Self-Displacement Sensing for Electromagnetic Actuators.

[BibT_eX]

[DOI]

IEEE Trans. Ind. Electron., November, 2024

A Nonarray Soft Capacitive Tactile Sensor With Simultaneous Contact Force and Location Measurement for Intelligent Robotic Grippers.

[BibT_eX]

[DOI]

IEEE Trans. Instrum. Meas., 2024

2022

A Stick on, Film-Like, Split Angle Sensor via Magnetic Induction for Versatile Applications.

[BibT_eX]

[DOI]

IEEE Trans. Instrum. Meas., 2022

Houping Wu

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