Houman Zahedmanesh

According to our database, Houman Zahedmanesh authored at least 15 papers between 2009 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

De-Coupling Thermo-Migration from Electromigration Using a Dedicated Test Structure.

O. Varela Pedreira, Youqi Ding, D. Coenen, Philippe Roussel, A. S. Saleh, Veerle Simons, Houman Zahedmanesh, Ivan Ciofi, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2024

2023

Challenges for Interconnect Reliability: From Element to System Level.

Olalla Varela Pedreira, Houman Zahedmanesh, Youqi Ding, Ivan Ciofi, Kristof Croes

Proceedings of the 2023 International Symposium on Physical Design, 2023

A pragmatic network-aware paradigm for system-level electromigration predictions at scale.

Houman Zahedmanesh, Philippe Roussel, Ivan Ciofi, Kristof Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2023

Impact of via geometry and line extension on via-electromigration in nano-interconnects.

A. S. Saleh, Houman Zahedmanesh, Hajdin Ceric, Ingrid De Wolf, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2023

Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters.

Youqi Ding, O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, T. Chavez, Hosain Farr, Ingrid De Wolf, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022

Time-Dependent Electromigration Modeling for Workload-Aware Design-Space Exploration in STT-MRAM.

Mahta Mayahinia, Mehdi B. Tahoori, Manu Perumkunnil Komalan, Houman Zahedmanesh, Kristof Croes, Tommaso Marinelli, José Ignacio Gómez Pérez, Timon Evenblij, Gouri Sankar Kar, Francky Catthoor

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2022

System-Level Simulation of Electromigration in a 3 nm CMOS Power Delivery Network: The Effect of Grid Redundancy, Metallization Stack and Standard-Cell Currents.

Houman Zahedmanesh, Ivan Ciofi, Odysseas Zografos, Kristof Croes, Mustafa Badaroglu

Proceedings of the IEEE International Reliability Physics Symposium, 2022

Assessment of critical Co electromigration parameters.

O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, Philippe J. Roussel, Marleen H. van der Veen, Veerle Simons, Emmanuel Chery, Ivan Ciofi, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2022

2021

A Novel System-Level Physics-Based Electromigration Modelling Framework: Application to the Power Delivery Network.

Houman Zahedmanesh, Ivan Ciofi, Odysseas Zografos, Mustafa Badaroglu, Kristof Croes

Proceedings of the ACM/IEEE International Workshop on System Level Interconnect Prediction, 2021

Electromigration limits of copper nano-interconnects.

Houman Zahedmanesh, Olalla Varela Pedreira, Zsolt Tokei, Kristof Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2021

2020

Physics based modeling of bimodal electromigration failure distributions and variation analysis for VLSI interconnects.

Sarath Mohanachandran Nair, Rajendra Bishnoi, Mehdi B. Tahoori, Houman Zahedmanesh, Kristof Croes, Kevin Garello, Gouri Sankar Kar, Francky Catthoor

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2019

Variation-Aware Physics-Based Electromigration Modeling and Experimental Calibration for VLSI Interconnects.

Sarath Mohanachandran Nair, Rajendra Bishnoi, Mehdi Baradaran Tahoori, Houman Zahedmanesh, Kristof Croes, Kevin Garello, Gouri Sankar Kar, Francky Catthoor

Proceedings of the IEEE International Reliability Physics Symposium, 2019

2018

Stress mitigation of 3D-stacking/packaging induced stresses.

Kristof Croes, Vladimir Cherman, Melina Lofrano, Houman Zahedmanesh, Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Zsolt Tökei, Eric Beyne

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2016

Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation.

Houman Zahedmanesh, Mario Gonzalez, Ivan Ciofi, Kristof Croes, Jürgen Bömmels, Zsolt Tökei

Microelectron. Reliab., 2016

2009

Determination of the influence of stent strut thickness using the finite element method: implications for vascular injury and in-stent restenosis.

Houman Zahedmanesh, Caitríona Lally

Medical Biol. Eng. Comput., 2009