Hosain Farr
According to our database1,
Hosain Farr
authored at least 2 papers
between 2018 and 2023.
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Bibliography
2023
Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters.
Proceedings of the IEEE International Reliability Physics Symposium, 2023
2018
Proceedings of the IEEE International Reliability Physics Symposium, 2018