Hosadurga Shobha

According to our database, Hosadurga Shobha authored at least 3 papers between 2018 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

Backside Power Distribution for Nanosheet Technologies Beyond 2nm.

Ruilong Xie, Wonhyuk Hong, Chen Zhang, Jongjin Lee, Kevin Brew, Richard Johnson, Nicholas A. Lanzillo, Hosadurga Shobha, Taesun Kim, Panjae Park, Shogo Mochizuki, Iqbal Saraf, Chanro Park, Lei Zhuang, Clifford Osborn, Wai Kin Li, Feng Liu, Muthumanickam Sankarapandian, Chung Ju Yang, Juntao Li, Lukas Tierney, Ruturaj Pujari, Yasir Sulehria, Yuncheng Song, Huimei Zhou, Miaomiao Wang, Michael Belyansky, Somnath Ghosh, Haojun Zhang, Koichi Motoyama, Debarghya Sarkar, Wukang Kim, Albert Chu, Tao Li, Fabio Carta, Oleg Gluschenkov, Joongsuk Oh, Matthew Malley, Pinlei Chu, Son Nguyen, Katherine Luedders, Joe Lee, Shahrukh Khan, Prabudhya Roy Chowdhury, Huai Huang, Abir Shadman, Stuart Sieg, Daniel Dechene, Daniel Edelstein, John Arnold, Tenko Yamashita, Kisik Choi, Kang-ill Seo, Dechao Guo, Huiming Bu

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

2022

Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects.

Takeshi Nogami, Oleg Gluschenkov, Yasir Sulehria, Son Nguyen, Brown Peethala, Huai Huang, Hosadurga Shobha, Nick A. Lanzillo, Raghuveer Patlolla, Devika Sil, Andrew Simon, Daniel Edelstein, Nelson Felix, Junjun Liu, Toshiyuki Tabata, Fulvio Mazzamuto, Sebastien Halty, Fabien Rozé, Yasutoshi Okuno, Akira Uedono

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

2018

Future on-chip interconnect metallization and electromigration.

Chao-Kun Hu, James J. Kelly, Huai Huang, Koichi Motoyama, Hosadurga Shobha, Yuri Ostrovski, James H.-C. Chen, Raghuveer Patlolla, Brown Peethala, Praneet Adusumilli, Terry A. Spooner, Roger Quon, Lynne M. Gignac, Chris M. Breslin, G. Lian, M. Ali, Jacob Benedict, X. S. Lin, S. Smith, Vimal Kamineni, X. Zhang, Frank Wilhelm Mont, Shariq Siddiqui, Frieder H. Baumann

Proceedings of the IEEE International Reliability Physics Symposium, 2018