Horst Rempp

According to our database, Horst Rempp authored at least 4 papers between 2008 and 2014.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2014

Thermal characterization and modeling of ultra-thin silicon chips.

Muhammad Alshahed, Zili Yu, Horst Rempp, Harald Richter, Christine Harendt, Joachim N. Burghartz

Proceedings of the 44th European Solid State Device Research Conference, 2014

2012

Manufacturing aspects of an ultra-thin chip technology.

Evangelos A. Angelopoulos, Muhammad S. Al-Shahed, Wolfgang Appel, Stefan Endler, Saleh Ferwana, Christine Harendt, Mahadi-Ul Hassan, Horst Rempp, Martin Zimmermann, Joachim N. Burghartz

Proceedings of the 2012 European Solid-State Device Research Conference, 2012

2009

Ultra-thin chips and related applications, a new paradigm in silicon technology.

Joachim N. Burghartz, Wolfgang Appel, Christine Harendt, Horst Rempp, Harald Richter, Martin Zimmermann

Proceedings of the 35th European Solid-State Circuits Conference, 2009

2008

Ultra-Thin Chips on Foil for Flexible Electronics.

Horst Rempp, Joachim N. Burghartz, Christine Harendt, Nicoleta Pricopi, Marcus Pritschow, Christian Reuter, Harald Richter, Inge Schindler, Martin Zimmermann

Proceedings of the 2008 IEEE International Solid-State Circuits Conference, 2008