Hongqi Ding

Orcid: 0000-0001-9543-4183

According to our database¹, Hongqi Ding authored at least 3 papers between 2020 and 2024.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of four.

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Bibliography

2024

An Internal Thermal Distribution Balance Control Between the Top and Bottom Devices in Modular Multilevel Converter.

[BibT_eX]

[DOI]

IEEE Trans. Ind. Electron., September, 2024

2021

A Junction Temperature Balance Control Among Sub-Modules for Modular Multilevel Converter.

[BibT_eX]

[DOI]

Proceedings of the IECON 2021, 2021

2020

Thermal Stress Balancing Oriented Model Predictive Control of Modular Multilevel Switching Power Amplifier.

[BibT_eX]

[DOI]

IEEE Trans. Ind. Electron., 2020

Hongqi Ding

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