Hongfei Deng

According to our database, Hongfei Deng authored at least 10 papers between 2020 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

Instance segmentation by blend U-Net and VOLO network.

Hongfei Deng, Bin Wen, Rui Wang, Zuwei Feng

IET Comput. Vis., September, 2024

Adoption of Recurrent Innovations: A Large-Scale Case Study on Mobile App Updates.

Fuqi Lin, Xuan Lu, Wei Ai, Huoran Li, Yun Ma, Yulian Yang, Hongfei Deng, Qingxiang Wang, Qiaozhu Mei, Xuanzhe Liu

ACM Trans. Web, February, 2024

Investigations of SiC lateral MOSFET with high-k and equivalent variable lateral doping techniques.

Moufu Kong, Hongfei Deng, Yingzhi Luo, Jiayan Zhu, Bo Yi, Hongqiang Yang, Qiang Hu, Fanxin Meng

Microelectron. J., 2024

Improved Image Coloring Method for Ethnic Costumes based on Diffusion Models.

Runze Zhang, Bin Wen, Hongfei Deng

Proceedings of the 2024 13th International Conference on Computing and Pattern Recognition, 2024

2023

Early Warning Model for Transmission line Deicing Jumps Based on BP Neural Network.

Mingguan Zhao, Jianlin Hu, Meng Li, Yang Yang, Xinsheng Dong, Hongfei Deng, Yijie Liu, Weiyi Zeng, Peiyu Qin

Proceedings of the IEEE Sustainable Power and Energy Conference, 2023

Online Early Warning Model of Windage Yaw Discharge on Transmission Lines Based on Monte Carlo Random Sampling.

Meng Li, Jianlin Hu, Mingguan Zhao, Yang Yang, Xinsheng Dong, Hongfei Deng, Yijie Liu, Peiyu Qin, Weiyi Zeng

Proceedings of the IEEE Sustainable Power and Energy Conference, 2023

Improved Leaf Segmentation Method for UNet Feature Encoding.

Hongfei Deng, Bin Wen

Proceedings of the 2023 12th International Conference on Computing and Pattern Recognition, 2023

A Novel 1200-V Class SiC MOSFET With Schottky Barrier Diode for Improved third quadrant performance.

Moufu Kong, Zhi Lin, Hongfei Deng, Bo Yi, Rui Jin, Hongqiang Yang

Proceedings of the 15th IEEE International Conference on ASIC, 2023

2021

Fatigue Mechanism of Die-Attach Joints in IGBTs Under Low-Amplitude Temperature Swings Based on 3D Electro-Thermal-Mechanical FE Simulations.

Yongle Huang, Hongfei Deng, Yifei Luo, Fei Xiao, Binli Liu, Xin Tang

IEEE Trans. Ind. Electron., 2021

2020

Characterizing Service Access Patterns under Heterogeneous Clients.

Shuyu Zheng, Fuqi Lin, Xuan Lu, Yulian Yang, Hongfei Deng, Jun Zhang, Yun Ma, Xuanzhe Liu

Proceedings of the 2020 IEEE International Conference on Services Computing, 2020