Hong-Wen Chiou

According to our database, Hong-Wen Chiou authored at least 6 papers between 2017 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2023

Phone-nomenon 2.0: A compact thermal model for smartphones.

Yu-Min Lee, Hong-Wen Chiou, Shin-Yu Shiau, Chi-Wen Pan, Shih-Ting Lin

IET Comput. Digit. Tech., March, 2023

Chiplet Placement for 2.5D IC with Sequence Pair Based Tree and Thermal Consideration.

Hong-Wen Chiou, Jia-Hao Jiang, Yu-Teng Chang, Yu-Min Lee, Chi-Wen Pan

Proceedings of the 28th Asia and South Pacific Design Automation Conference, 2023

2021

Thermal Pad Design Flow for Automotive Electronics.

Guan-Jia Chen, Hong-Wen Chiou, Yu-Teng Chang, Yu-Min Lee

Proceedings of the IEEE International Conference on Consumer Electronics-Taiwan, 2021

2019

Multi-angle bended heat pipe design using x-architecture routing with dynamic thermal weight on mobile devices.

Hsuan-Hsuan Hsiao, Hong-Wen Chiou, Yu-Min Lee

Proceedings of the 24th Asia and South Pacific Design Automation Conference, 2019

Phone-nomenon: a system-level thermal simulator for handheld devices.

Hong-Wen Chiou, Yu-Min Lee, Shin-Yu Shiau, Chi-Wen Pan, Tai-Yu Chen

Proceedings of the 24th Asia and South Pacific Design Automation Conference, 2019

2017

Thermal modeling and design on smartphones with heat pipe cooling technique.

Hong-Wen Chiou, Yu-Min Lee, Hsuan-Hsuan Hsiao, Liang-Chia Cheng

Proceedings of the 2017 IEEE/ACM International Conference on Computer-Aided Design, 2017