Hohyun Chae

According to our database, Hohyun Chae authored at least 1 paper in 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

A Low-Voltage Area-Efficient TSV I/O for HBM with Data Rate up to 15Gb/s Featuring Overlapped Multiplexing Driver, ISI Compensators and QEC.

Taeryeong Kim, Ji-Young Kim, Jeonghyeok You, Hohyun Chae, Byoung-Mo Moon, Kyomin Sohn, Seong-Ook Jung

Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023