Hoa Do

According to our database, Hoa Do authored at least 2 papers between 2015 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2021

CCECE 2021 Invited Paper: Holistic Performance, Reliability and Thermal Understanding of HPC Real Utilization on Silicon Architecture.

Gamal Refai-Ahmed, Hoa Do, I-Ru Chen, Jae-Gyung Ahn, Huayan Wang, Xin Wu, Suresh Ramalingam

Proceedings of the 34th IEEE Canadian Conference on Electrical and Computer Engineering, 2021

2015

Best engineering practice for thermal characterization of stacked dice FPGA devices.

Arun Raghupathy, Hoa Do, Brian Philofsky, Gamal Refai-Ahmed

Proceedings of the 2015 International 3D Systems Integration Conference, 2015