Hisashi Kino
Orcid: 0000-0001-9348-120XAffiliations:
- Tohoku University, Sendai, Miyagi, Japan
According to our database1,
Hisashi Kino
authored at least 22 papers
between 2009 and 2023.
Collaborative distances:
Collaborative distances:
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Bibliography
2023
Development of Trans-nail PPG Controller Using Fingertip Blood Volume Changes to Enable Highly Accurate Motion Prediction.
Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2023
Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last.
Proceedings of the IEEE International 3D Systems Integration Conference, 2023
2022
3D-stacked retinal prosthesis chip with binary image capture and edge detection functions for human visual restoration.
IEICE Electron. Express, 2022
Implementation of Light and Dark Adaptation Function for High QOL 3D-Stacked Artificial Retina Chip.
Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2022
2021
Design and Evaluation of Electronic-Microsaccade with Balanced Stimulation for Artificial Vision System.
Proceedings of the IEEE Biomedical Circuits and Systems Conference, BioCAS 2021, 2021
Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing.
Proceedings of the IEEE International 3D Systems Integration Conference, 2021
2019
PPG and SpO2 Recording Circuit with Ambient Light Cancellation for Trans-Nail Pulse-Wave Monitoring System.
Proceedings of the 2019 IEEE Biomedical Circuits and Systems Conference, 2019
Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO2 for Low-Temperature TSV Liner Formation.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
Development of a CDS Circuit for 3-D Stacked Neural Network Chip using CMOS Analog Signal Processing.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
Investigation of the Underfill with Negative-Thermal-Expansion Material to Suppress Mechanical Stress in 3D Integration System.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
2018
Continuous Peripheral Blood Pressure Measurement with ECG and PPG Signals at Fingertips.
Proceedings of the 2018 IEEE Biomedical Circuits and Systems Conference, 2018
2017
Ultrawide range square wave impedance analysis circuit with ultra-slow ring-oscillator using gate-induced drain-leakage current.
Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2017
Experimental evaluation of stimulus current generator with Laplacian edge-enhancement for 3-D stacked retinal prosthesis chip.
Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2017
2016
Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration.
Micromachines, 2016
Wide-range and precise tissue impedance analysis circuit with ultralow current source using gate-induced drain-leakage current.
Proceedings of the IEEE Biomedical Circuits and Systems Conference, 2016
Drastic reduction of keep-out-zone in 3D-IC by local stress suppression with negative-CTE filler.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016
2015
Novel local stress evaluation method in 3D IC using DRAM cell array with planar mOS capacitors.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
2013
Multiple optical stimulation to neuron using Si opto-neural probe with multiple optical waveguides and metal-cover for optogenetics.
Proceedings of the 35th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2013
2009
Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration.
Proceedings of the IEEE International Conference on 3D System Integration, 2009