Hiroyuki Hashimoto
According to our database1,
Hiroyuki Hashimoto
authored at least 23 papers
between 1995 and 2024.
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Bibliography
2024
Impact of Cu Pad Density on Cu-CMP and Bonding Yield for Chip-to-Wafer Hybrid Bonding.
Proceedings of the International 3D Systems Integration Conference, 2024
2021
Proceedings of the IEEE International 3D Systems Integration Conference, 2021
Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing.
Proceedings of the IEEE International 3D Systems Integration Conference, 2021
2020
CVaR-constrained Stochastic Bidding Strategy for a Virtual Power Plant with Mobile Energy Storages.
Proceedings of the IEEE PES Innovative Smart Grid Technologies Europe, 2020
2019
IEEE Trans. Smart Grid, 2019
Fabrication and Morphological Characterization of Nano-Scale Interconnects for 3D-Integration.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
Development of a CDS Circuit for 3-D Stacked Neural Network Chip using CMOS Analog Signal Processing.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019
2018
J. Robotics Mechatronics, 2018
Intra- and inter-chip electrical interconnection formed by directed self assembly of nanocomposite containing diblock copolymer and nanometal.
Proceedings of the IEEE International Reliability Physics Symposium, 2018
Proceedings of the 5th International Conference on Information and Communication Technologies for Disaster Management, 2018
2017
Three-level co-optimization model for generation scheduling of integrated energy and regulation market.
Proceedings of the 2017 IEEE Innovative Smart Grid Technologies - Asia, 2017
2016
Mitigating substation demand fluctuations using decoupled price schemes for demand response.
Proceedings of the 2016 IEEE Power & Energy Society Innovative Smart Grid Technologies Conference, 2016
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016
2015
Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
2014
Toward digital staining using stimulated Raman scattering and statistical machine learning.
Proceedings of the Medical Imaging 2014: Digital Pathology, 2014
2013
A block-parallel ADC with digital noise cancelling for 3-D stacked CMOS image sensor.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
Highly efficient TSV repair technology for resilient 3-D stacked multicore processor system.
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
2012
Examination of mitral regurgitation with a goat heart model for the development of intelligent artificial papillary muscle.
Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2012
2011
Adaptive three-dimensional wavelet analysis for denoising TOF-SIMS images: Toward digital staining of pathological specimens.
Proceedings of the 4th International Conference on Biomedical Engineering and Informatics, 2011
2003
J. Robotics Mechatronics, 2003
1996
Proceedings of the 1996 International Symposium on Parallel Architectures, 1996
1995
Proceedings of the 4th International Conference on Computer Communications and Networks (ICCCN '95), 1995