Hirohiko Endoh

According to our database, Hirohiko Endoh authored at least 2 papers between 2013 and 2015.

Collaborative distances:

• Dijkstra number of seven.
• Erdős number of seven.

2015

Copper wire bonding package decapsulation using the anodic protection method.

Hirohiko Endoh, Takuya Naoe

Microelectron. Reliab., 2015

2013

Local damage free Si substrate ultra thinning for backside emission spectral analysis using OBPF for LSI failure mode detection.

Takuya Naoe, Tamao Ikeuchi, Chie Moritni, Hirohiko Endoh, Kohichi Yokoyama

Microelectron. Reliab., 2013