Hideo Miura

According to our database, Hideo Miura authored at least 5 papers between 2011 and 2019.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2019

Crystallinity Dependence of Long-Term Reliability of Electroplated Gold Thin-Film Interconnections.

Ken Suzuki, Ryota Mizuno, Yutaro Nakoshi, Hideo Miura

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2015

Thermal stability of electroplated copper thin-film interconnections.

Pornvitoo Rittinon, Ken Suzuki, Hideo Miura

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Variation of thermal stress in TSV structures caused by crystallinity of electroplated copper interconnections.

Jiatong Liu, Ken Suzuki, Hideo Miura

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2011

Mechanical and electrical reliability of copper interconnections for 3DIC.

Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Minimization of the local residual stress in 3DICs by controlling the structures and mechanical properties of 3D interconnections.

Kota Nakahira, Fumiaki Endo, Ryosuke Furuya, Ken Suzuki, Hideo Miura

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011