Hideki Kitada

According to our database, Hideki Kitada authored at least 5 papers between 2011 and 2016.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2016

Study of MOSFET thermal stability with TSV in operation temperature using novel 3D-LSI stress analysis.

Hideki Kitada, Hiroko Tashiro, Shoichi Miyahara, Takeshi Ishitsuka, Aki Dote, Shinji Tadaki, Tatsumi Nakada, Seiki Sakuyama

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2013

Influence of wafer thinning process on backside damage in 3D integration.

Tadao Nakamura, Yoriko Mizushima, Hideki Kitada, Young-Suk Kim, Nobuhide Maeda, Shoichi Kodama, Ryuichi Sugie, Hiroshi Hashimoto, Akihito Kawai, Kazuhisa Arai, Akira Uedono, Takayuki Ohba

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011

Characterization of local strain around trough silicon via interconnects in wafer-on-wafer structures.

Osamu Nakatsuka, Hideki Kitada, Young-Suk Kim, Yoriko Mizushima, Tomoji Nakamura, Takayuki Ohba, Shigeaki Zaima

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Comparative study of side-wall roughness effects on leakage currents in through-silicon via interconnects.

Tomoji Nakamura, Hideki Kitada, Yoriko Mizushima, Nobuhide Maeda, Koji Fujimoto, Takayuki Ohba

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

Development of ultra-thinning technology for logic and memory heterogeneous stack applications.

Nobuhide Maeda, Young-Suk Kim, Y. Hikosaka, T. Eshita, Hideki Kitada, K. Fujimoto, Yoriko Mizushima, K. Suzuki, Tadao Nakamura, Akihito Kawai, Kazuhisa Arai, Takayuki Ohba

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011