Hervé Morel
Orcid: 0000-0001-7866-0437
According to our database1,
Hervé Morel
authored at least 23 papers
between 2001 and 2024.
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Bibliography
2024
Physics-Based Strategies for Fast TDDB Testing and Lifetime Estimation in SiC Power MOSFETs.
IEEE Trans. Ind. Electron., May, 2024
2023
IEEE Trans. Control. Syst. Technol., July, 2023
Full-SiC Single-Chip Buck and Boost MOSFET-JBS Converters for Ultimate Efficient Power Vertical Integration.
Proceedings of the 30th International Conference on Mixed Design of Integrated Circuits and System, 2023
2022
Microelectron. J., 2022
2021
Proceedings of the 2021 60th IEEE Conference on Decision and Control (CDC), 2021
2019
VTH-Hysteresis and Interface States Characterisation in SiC Power MOSFETs with Planar and Trench Gate.
Proceedings of the IEEE International Reliability Physics Symposium, 2019
Proceedings of the IECON 2019, 2019
2018
Microelectron. Reliab., 2018
Threshold voltage instability in SiC MOSFETs as a consequence of current conduction in their body diode.
Microelectron. Reliab., 2018
<i>V</i><sub><i>TH</i></sub> subthreshold hysteresis technology and temperature dependence in commercial 4H-SiC MOSFETs.
Microelectron. Reliab., 2018
Proceedings of the IEEE International Conference on Industrial Technology, 2018
2017
IEEE Trans. Ind. Electron., 2017
Microelectron. Reliab., 2017
Lifetime of power electronics interconnections in accelerated test conditions: High temperature storage and thermal cycling.
Microelectron. Reliab., 2017
Microelectron. Reliab., 2017
Proceedings of the International Conference on Control, Automation and Diagnosis, 2017
2016
2015
A Novel Approach to Extract the Thyristor Design Parameters for Designing of Power Electronic Systems.
IEEE Trans. Ind. Electron., 2015
Study of short-circuit robustness of SiC MOSFETs, analysis of the failure modes and comparison with BJTs.
Microelectron. Reliab., 2015
2011
2010
IEEE Trans. Instrum. Meas., 2010
Characterization, Modeling and Design Parameters Identification of Silicon Carbide Junction Field Effect Transistor for Temperature Sensor Applications.
Sensors, 2010
2001
On the validity of the standard SPICE model of the diode for simulation in power electronics.
IEEE Trans. Ind. Electron., 2001