Herman Oprins

According to our database, Herman Oprins authored at least 22 papers between 2008 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

Multidie 3-D Stacking of Memory Dominated Neuromorphic Architectures.

Leandro Mateus Giacomini Rocha, Refik Bilgic, Mohamed Naeim, Sudipta Das, Herman Oprins, Amirreza Yousefzadeh, Mario Konijnenburg, Dragomir Milojevic, James Myers, Julien Ryckaert, Dwaipayan Biswas

IEEE Trans. Very Large Scale Integr. Syst., November, 2024

Thermal Considerations for Block-Level PPA Assessment in Angstrom Era: A Comparison Study of Nanosheet FETs (A10) & Complementary FETs (A5).

S. Mishra, Bjorn Vermeersch, Sankatali Venkateswarlu, Halil Kukner, Gioele Mirabelli, Fabian M. Bufler, Moritz Brunion, Dawit Burusie Abdi, Herman Oprins, Dwaipayan Biswas, Odysseas Zografos, Francky Catthoor, Pieter Weckx, Geert Hellings, James Myers, Julien Ryckaert

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

Thermal Analysis of 3D Stacking and BEOL Technologies with Functional Partitioning of Many-Core RISC-V SoC.

Mohamed Naeim, Herman Oprins, Sudipta Das, Geert Van der Plas, Yun Dai, Pinhong Chen, CT Kao, Dwaipayan Biswas, Dragomir Milojevic

Proceedings of the IEEE Computer Society Annual Symposium on VLSI, 2024

Thermal Performance Evaluation of Multi-Core SOCs Using Power-Thermal Co-Simulation.

Subrat Mishra, Bjorn Vermeersch, Sankatali Venkateswarlu, Halil Kukner, A. Sharma, G. Mirabeli, Fabian M. Bufler, Moritz Brunion, Dawit Burusie Abdi, Herman Oprins, Dwaipayan Biswas, Odysseas Zografos, Francky Catthoor, Pieter Weckx, Geert Hellings, James Myers, Julien Ryckaert

Proceedings of the IEEE International Reliability Physics Symposium, 2024

2023

Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC.

Sankatali Venkateswarlu, Subrat Mishra, Herman Oprins, Bjorn Vermeersch, Moritz Brunion, Jun-Han Han, Mircea R. Stan, Dwaipayan Biswas, Pieter Weckx, Francky Catthoor

IEEE Trans. Very Large Scale Integr. Syst., December, 2023

Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits.

David Coenen, Herman Oprins, Robin Degraeve, Ingrid De Wolf

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., July, 2023

Coupled Dynamic Thermo-Optical Analysis and Compact Modelling of Self-Heating in Ring Modulator.

David Coenen, Minkyu Kim, Herman Oprins, Ingrid De Wolf, Yoojin Ban, Joris Van Campenhout

Proceedings of the International Conference on Photonics in Switching and Computing, 2023

Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs).

Subrat Mishra, Sankatali Venkateswarlu, Bjorn Vermeersch, Moritz Brunion, Melina Lofrano, Dawit Burusie Abdi, Herman Oprins, Dwaipayan Biswas, Odysseas Zografos, Gaspard Hiblot, Geert Van der Plas, Pieter Weckx, Geert Hellings, James Myers, Francky Catthoor, Julien Ryckaert

Proceedings of the IEEE International Reliability Physics Symposium, 2023

Towards accurate temperature prediction in BEOL for reliability assessment (Invited).

Melina Lofrano, Herman Oprins, Xinyue Chang, Bjorn Vermeersch, Olalla Varela Pedreira, Alicja Lesniewska, Vladimir Cherman, Ivan Ciofi, Kristof Croes, Seongho Park, Zsolt Tokei

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022

Thermal Performance Analysis of Mempool RISC-V Multicore SoC.

Sankatali Venkateswarlu, Subrat Mishra, Herman Oprins, Bjorn Vermeersch, Moritz Brunion, Jun-Han Han, Mircea R. Stan, Pieter Weckx, Francky Catthoor

IEEE Trans. Very Large Scale Integr. Syst., 2022

2019

Understanding EM-Degradation Mechanisms in Metal Heaters Used for Si Photonics Applications.

Kris Croes, Veerle Simons, Sofie Beyne, Vladimir Cherman, Herman Oprins, Michele Stucchi, Philippe Absil, A. Glabman, Eric Wilcox

Proceedings of the IEEE International Reliability Physics Symposium, 2019

2016

New fast distributed thermal model for analysis of GaN based power devices.

Vice Sodan, Federica Lidia Teresa Maggioni, Herman Oprins, Steve Stoffels, Martine Baelmans, Ingrid De Wolf

Proceedings of the 46th European Solid-State Device Research Conference, 2016

2015

Thermal experimental and modeling analysis of high power 3D packages.

Herman Oprins, Vladimir Cherman, Geert Van der Plas, F. L. T. Maggioni, Joeri De Vos, Eric Beyne

Proceedings of the 2015 International Conference on IC Design & Technology, 2015

2014

Fast convolution based thermal model for 3D-ICs: Methodology, accuracy analysis and package impact.

F. L. T. Maggioni, Herman Oprins, Eric Beyne, Ingrid De Wolf, Martine Baelmans

Microelectron. J., 2014

2012

Modeling and Control of Electrowetting Induced Droplet Motion.

Herman Oprins, Bart Vandevelde, Martine Baelmans

Micromachines, 2012

2011

Fine grain thermal modeling and experimental validation of 3D-ICs.

Herman Oprins, Adi Srinivasan, Miroslav Cupák, Vladimir Cherman, Cristina Torregiani, Michele Stucchi, Geert Van der Plas, Paul Marchal, Bart Vandevelde, E. Cheng

Microelectron. J., 2011

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.

Geert Van der Plas, Paresh Limaye, Igor Loi, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Antonio Pullini, Federico Angiolini, Luca Benini, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal

IEEE J. Solid State Circuits, 2011

DRAM-on-logic Stack - Calibrated thermal and mechanical models integrated into PathFinding flow.

Dragomir Milojevic, Herman Oprins, Julien Ryckaert, Paul Marchal, Geert Van der Plas

Proceedings of the 2011 IEEE Custom Integrated Circuits Conference, 2011

2010

Design issues and considerations for low-cost 3D TSV IC technology.

Geert Van der Plas, Paresh Limaye, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Domae Shinichi, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Pol Marchal, Eric Beyne

Proceedings of the IEEE International Solid-State Circuits Conference, 2010

3D integration: Circuit design, test, and reliability challenges.

Nikolaos Minas, Ingrid De Wolf, Erik Jan Marinissen, Michele Stucchi, Herman Oprins, Abdelkarim Mercha, Geert Van der Plas, Dimitrios Velenis, Pol Marchal

Proceedings of the 16th IEEE International On-Line Testing Symposium (IOLTS 2010), 2010

Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions.

Geert Van der Plas, Steven Thijs, Dimitri Linten, Guruprasad Katti, Paresh Limaye, Abdelkarim Mercha, Michele Stucchi, Herman Oprins, Bart Vandevelde, Nikolaos Minas, Miro Cupac, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal

Proceedings of the IEEE Custom Integrated Circuits Conference, 2010

2008

Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling.

Herman Oprins, J. Danneels, B. Van Ham, Bart Vandevelde, Martine Baelmans

Microelectron. J., 2008