Herbert Reichl

According to our database, Herbert Reichl authored at least 24 papers between 1999 and 2011.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2011

Simulation and experimental analysis of large area substrate overmolding with epoxy molding compounds.

Thomas Schreier-Alt, Frank Rehme, Frank Ansorge, Herbert Reichl

Microelectron. Reliab., 2011

2010

Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling.

Bernhard Wunderle, E. Dermitzaki, O. Hölck, Jörg Bauer, Hans Walter, Q. Shaik, K. Rätzke, Franz Faupel, Bernd Michel, Herbert Reichl

Microelectron. Reliab., 2010

2009

Entwurf von Aufbau- und Verbindungstechniken für die Elektromagnetische Zuverlässigkeit von Mikrosystemen unter Verwendung des M3-Ansatzes.

Herbert Reichl, Ivan N. Ndip

Proceedings of the Methoden und Beschreibungssprachen zur Modellierung und Verifikation von Schaltungen und Systemen (MBMV), 2009

Stretchable Circuit Board Technology and Application.

Rene Vieroth, Thomas Löher, Manuel Seckel, Christian Dils, Christine Kallmayer, Andreas Ostmann, Herbert Reichl

Proceedings of the 13th IEEE International Symposium on Wearable Computers (ISWC 2009), 2009

SENESCOPE: A design tool for cost optimization of wireless sensor nodes.

M. Niedermayer, C. Richter, J. Hefer, Stephan Guttowski, Herbert Reichl

Proceedings of the 8th International Conference on Information Processing in Sensor Networks, 2009

3-D thin chip integration technology - from technology development to application.

Thomas Fritzsch, Raul Mrossko, Tobias Baumgartner, Michael Toepper, Matthias Klein, Jürgen Wolf, Bernhard Wunderle, Herbert Reichl

Proceedings of the IEEE International Conference on 3D System Integration, 2009

2008

Optimization of efficiency and energy density of passive micro fuel cells and galvanic hydrogen generators

Robert Hahn, Stefan Wagner, Steffen Krumbholz, Herbert Reichl

CoRR, 2008

Technologies for 3D Heterogeneous Integration

Jürgen Wolf, Peter Ramm, Armin Klumpp, Herbert Reichl

CoRR, 2008

Lamination And Microstructuring Technology for a Bio-Cell Multiwell array

Erik Jung, Dionysios Manessis, Alexander Neumann, Lars Böttcher, Tanja Braun, Jörg Bauer, Herbert Reichl, Bruno Iafelice, Federica Destro, Roberto Gambari

CoRR, 2008

2006

High-temperature reliability of Flip Chip assemblies.

Tanja Braun, Karl-Friedrich Becker, Mathias Koch, Volker Bader, Rolf Aschenbrenner, Herbert Reichl

Microelectron. Reliab., 2006

Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies.

M. Niedermayer, Stephan Guttowski, Rolf Thomasius, David Dmitry Polityko, K. Schrank, Herbert Reichl

Proceedings of the Fifth International Conference on Information Processing in Sensor Networks, 2006

Modellierung geschirmter Leistungskabel im Frequenzbereich der EMV.

Stefan-Peter Weber, André Linde, Eckart Hoene, Stephan Guttowski, Werner John, Herbert Reichl

Proceedings of the EMV 2006 - Internationale Fachmesse und Kongress für Elektromagnetische Verträglichkeit, 2006

Vorhersage von magnetischen Kopplungen in Filterschaltungen.

Andre Lissner, Eckart Hoene, Stephan Guttowski, Werner John, Herbert Reichl

Proceedings of the EMV 2006 - Internationale Fachmesse und Kongress für Elektromagnetische Verträglichkeit, 2006

Fully Integrated EKG Shirt based on Embroidered Electrical Interconnections with Conductive Yarn and Miniaturized Flexible Electronics.

Torsten Linz, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl

Proceedings of the 2006 International Workshop on Wearable and Implantable Body Sensor Networks (BSN 2006), 2006

2005

Characterization of bump arrays at RF/microwave frequencies.

Ivan N. Ndip, Grit Sommer, Werner John, Herbert Reichl

Microelectron. Reliab., 2005

Reliability Potential Of Epoxy Based Encapsulants For Automotive Applications.

Tanja Braun, Karl-Friedrich Becker, Mathias Koch, Volker Bader, Rolf Aschenbrenner, Herbert Reichl

Microelectron. Reliab., 2005

Closed-form network representations of frequency-dependent <i>RLGC</i> parameters.

A. Ege Engin, Wolfgang Mathis, Werner John, Grit Sommer, Herbert Reichl

Int. J. Circuit Theory Appl., 2005

Embroidering Electrical Interconnects with Conductive Yarn for The Integration of Flexible Electronic Modules into Fabric.

Torsten Linz, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl

Proceedings of the Ninth IEEE International Symposium on Wearable Computers (ISWC 2005), 2005

Packaging Challenges in Miniaturization.

Christine Kallmayer, M. Niedermayer, Stephan Guttowski, Herbert Reichl

Proceedings of the Ambient Intelligence, 2005

2004

Parametric FE-approach to flip-chip reliability under various loading conditions.

Bernhard Wunderle, Wolfgang Nüchter, Andreas Schubert, Bernd Michel, Herbert Reichl

Microelectron. Reliab., 2004

Long time reliability study of soldered flip chips on flexible substrates.

Barbara Pahl, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl

Microelectron. Reliab., 2004

Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping.

Dionysios Manessis, Rainer Patzelt, Andreas Ostmann, Rolf Aschenbrenner, Herbert Reichl

Microelectron. Reliab., 2004

2002

Bump formation for flip chip and CSP by solder paste printing.

Joachim Kloeser, Paradiso Coskina, Rolf Aschenbrenner, Herbert Reichl

Microelectron. Reliab., 2002

1999

Batteries and Power Supplies for Wearable and Ubiquitous Computing.

Robert Hahn, Herbert Reichl

Proceedings of the Third International Symposium on Wearable Computers (ISWC 1999), 1999