We stand with Ukraine  

Helmut Köck

Orcid: 0000-0003-2183-5288

According to our database1, Helmut Köck authored at least 5 papers between 2007 and 2012.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Dataset
Other 

Links

Online presence:

On csauthors.net:

Bibliography

2012
Modeling of highly anisotropic microstructures for electro-thermal simulations of power semiconductor devices.
[BibTeX]
[DOI]
Stefano de Filippis
,
Helmut Köck
,
Michael Nelhiebel
,
Vladimír Kosel
,
Stefan Decker
,
Michael Glavanovics
,
Andrea Irace
Microelectron. Reliab., 2012

2011
Improved thermal management of low voltage power devices with optimized bond wire positions.
[BibTeX]
[DOI]
Helmut Köck
,
Christian Djelassi
,
Stefano de Filippis
,
Robert Illing
,
Michael Nelhiebel
,
Markus Ladurner
,
Michael Glavanovics
,
Dionyz Pogany
Microelectron. Reliab., 2011

ANSYS based 3D electro-thermal simulations for the evaluation of power MOSFETs robustness.
[BibTeX]
[DOI]
Stefano de Filippis
,
Vladimír Kosel
,
Donald Dibra
,
Stefan Decker
,
Helmut Köck
,
Andrea Irace
Microelectron. Reliab., 2011

2009
IR thermography and FEM simulation analysis of on-chip temperature during thermal-cycling power-metal reliability testing using in situ heated structures.
[BibTeX]
[DOI]
Helmut Köck
,
Vladimír Kosel
,
Christian Djelassi
,
Michael Glavanovics
,
Dionyz Pogany
Microelectron. Reliab., 2009

2007
Flexible active cycle stress testing of smart power switches.
[BibTeX]
[DOI]
Michael Glavanovics
,
Helmut Köck
,
Vladimír Kosel
,
Tobias Smorodin
Microelectron. Reliab., 2007


  Loading...