Hélène Frémont

According to our database, Hélène Frémont authored at least 42 papers between 2004 and 2023.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2023

Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits.

Stéphane Moreau, David Bouchu, J. Jourdon, Bassel Ayoub, S. Lhostis, Hélène Frémont, P. Lamontagne

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022

New Method to Perform TDDB Tests for Hybrid Bonding Interconnects.

Bassel Ayoub, Stéphane Moreau, S. Lhostis, P. Lamontagne, H. Combeau, J. G. Mattei, Hélène Frémont

Proceedings of the IEEE International Reliability Physics Symposium, 2022

2020

Readout Circuit Implemented on PCB-Level for Embedded CNT Sensors.

Quentin Vandier, Julien Pezard, Hélène Frémont, Éric Duchesne, Dominique Drouin

Proceedings of the 2020 IEEE International Instrumentation and Measurement Technology Conference, 2020

2019

Source Separation Using Sensor's Frequency Response: Theory and Practice on Carbon Nanotubes Sensors.

Aurore Quelennec, Éric Duchesne, Hélène Frémont, Dominique Drouin

Sensors, 2019

2018

Creep measurement and choice of creep laws for BGA assemblies' reliability simulation.

S. Pin, Alexandrine Guédon-Gracia, Jean-Yves Delétage, Hélène Frémont

Microelectron. Reliab., 2018

Sequential combined thermal cycling and vibration test and simulation of printed circuit board.

Faical Arabi, Alexandrine Guédon-Gracia, Jean-Yves Delétage, Hélène Frémont

Microelectron. Reliab., 2018

2017

High temperature ageing of microelectronics assemblies with SAC solder joints.

Wissam Sabbah, Pierre Bondue, Oriol Avino-Salvado, Cyril Buttay, Hélène Frémont, Alexandrine Guédon-Gracia, Hervé Morel

Microelectron. Reliab., 2017

Combined creep characterisation from single lap shear tests and 3D implementation for fatigue simulations.

S. Pin, Hélène Frémont, Alexandrine Guédon-Gracia

Microelectron. Reliab., 2017

Proceedings of the 28th European Symposium on the reliability of electron devices, failure physics and analysis.

Nathalie Labat, François Marc, Hélène Frémont, Marise Bafleur

Microelectron. Reliab., 2017

Effects of ageing on the conducted immunity of a voltage reference: Experimental study and modelling approach.

S. Hairoud-Airieau, Geneviève Duchamp, Tristan Dubois, Jean-Yves Delétage, André Durier, Hélène Frémont

Microelectron. Reliab., 2017

2016

Effects of salt spray test on lead-free solder alloy.

Alexandrine Guédon-Gracia, Hélène Frémont, Bernard Plano, Jean-Yves Delétage, Kirsten Weide-Zaage

Microelectron. Reliab., 2016

2015

Dynamical IMC-growth calculation.

Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont

Microelectron. Reliab., 2015

Electro- and thermomigration induced Cu₃Sn and Cu₆Sn₅ formation in SnAg_3.0Cu_0.5 bumps.

Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage, Bernard Plano

Microelectron. Reliab., 2015

A methodologic project to characterize and model COTS component reliability.

André Durier, Alain Bensoussan, Moustafa Zerarka, Chaimae Ghfiri, Alexandre Boyer, Hélène Frémont

Microelectron. Reliab., 2015

Characterization and model of temperature effect on the conducted immunity of Op-Amp.

Tristan Dubois, Siham Hairoud, Marcio Hermany Gomes de Oliveira, Hélène Frémont, Geneviève Duchamp

Microelectron. Reliab., 2015

Virtual prototyping in a Design-for-Reliability approach.

Samed Barnat, Alexandrine Guédon-Gracia, Hélène Frémont

Microelectron. Reliab., 2015

Editorial.

Marise Bafleur, Philippe Perdu, François Marc, Hélène Frémont, Nicolas Nolhier

Microelectron. Reliab., 2015

2014

Qualification procedure for moisture in embedded capacitors.

Hélène Frémont, Jörg Kludt, Massar Wade, Kirsten Weide-Zaage, Isabelle Bord-Majek, Geneviève Duchamp

Microelectron. Reliab., 2014

2013

Failure analysis of GaAs microwave devices with plastic encapsulation by electro-optical techniques.

W. Ben Naceur, Nathalie Malbert, Nathalie Labat, Hélène Frémont, D. Carisetti, J. C. Clement, J. L. Muraro, Barbara Bonnet

Microelectron. Reliab., 2013

Electro- and thermomigration-induced IMC formation in SnAg_3.0Cu_0.5 solder joints on nickel gold pads.

Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage, Bernard Plano

Microelectron. Reliab., 2013

Conductive adhesive joint for extreme temperature applications.

J. B. Jullien, Hélène Frémont, Jean-Yves Delétage

Microelectron. Reliab., 2013

2012

Electro- and thermo-migration induced failure mechanisms in Package on Package.

Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont

Microelectron. Reliab., 2012

Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers.

Lutz Meinshausen, Hélène Frémont, Kirsten Weide-Zaage

Microelectron. Reliab., 2012

Pushing toward the limits of acceleration: Example on wire-bond assemblies.

Jean-Baptiste Jullien, Bernard Plano, Hélène Frémont

Microelectron. Reliab., 2012

A methodological approach for predictive reliability: Practical case studies.

Hélène Frémont, Geneviève Duchamp, Alexandrine Guédon-Gracia, Frédéric Verdier

Microelectron. Reliab., 2012

Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength.

Samed Barnat, Hélène Frémont, Alexandrine Guédon-Gracia, Eric Cadalen

Microelectron. Reliab., 2012

International dimension to increase Lifelong Learning possibilities in Europe.

Jean-Marc Thiriet, Hamed Yahoui, Hélène Frémont

Proceedings of the 2012 International Conference on Information Technology Based Higher Education and Training, 2012

PhD in Electrical and Information Engineering in Europe: Towards a harmonization including LifeLong Learning.

Olivier Bonnaud, Hélène Frémont, Jean-Marc Thiriet, Hamed Yahoui

Proceedings of the 2012 International Conference on Information Technology Based Higher Education and Training, 2012

2011

Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps.

Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont

Microelectron. Reliab., 2011

Experimental power cycling on insulated TRIAC package: Reliability interpretation thanks to an innovative failure analysis flow.

A. Aubert, Sébastien Jacques, S. Pétremont, Nathalie Labat, Hélène Frémont

Microelectron. Reliab., 2011

2010

A fast moisture sensitivity level qualification method.

Xiaosong Ma, Kaspar M. B. Jansen, G. Q. Zhang, Willem D. van Driel, Olaf van der Sluis, Leo J. Ernst, C. Regards, Christian Gautier, Hélène Frémont

Microelectron. Reliab., 2010

Wearout estimation using the Robustness Validation methodology for components in 150 degreeC ambient automotive applications.

Pascal Lecuyer, Hélène Frémont, Jean-Pierre Landesman, Manoubi Auguste Bahi

Microelectron. Reliab., 2010

Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing.

A. Aubert, J. P. Rebrasse, Lionel Dantas de Morais, Nathalie Labat, Hélène Frémont

Microelectron. Reliab., 2010

2009

Fast reliability qualification of SiP products.

Charles Regard, Christian Gautier, Hélène Frémont, Patrick Poirier, Xiaosong Ma, Kaspar M. B. Jansen

Microelectron. Reliab., 2009

Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage.

Maxime Berthou, P. Retailleau, Hélène Frémont, Alexandrine Guédon-Gracia, C. Jéphos-Davennel

Microelectron. Reliab., 2009

A new methodology for the identification of ball bond degradation during high-temperature aging tests on devices in standard plastic packages.

Manoubi Auguste Bahi, Hélène Frémont, Jean-Pierre Landesman, Annabelle Gentil, Pascal Lecuyer

Microelectron. Reliab., 2009

2007

Dynamic void formation in a DD-copper-structure with different metallization geometry.

Kirsten Weide-Zaage, David Dalleau, Yves Danto, Hélène Frémont

Microelectron. Reliab., 2007

Torsion test applied for reballing and solder paste volume evaluation.

W. C. Maia Filho, M. Brizoux, Hélène Frémont, Yves Danto

Microelectron. Reliab., 2007

Sequential environmental stresses tests qualification for automotive components.

Manoubi Auguste Bahi, Pascal Lecuyer, Hélène Frémont, Jean-Pierre Landesman

Microelectron. Reliab., 2007

2006

Improved physical understanding of intermittent failure in continuous monitoring method.

W. C. Maia Filho, M. Brizoux, Hélène Frémont, Yves Danto

Microelectron. Reliab., 2006

2005

Moisture diffusion in Printed Circuit Boards: Measurements and Finite- Element- Simulations.

Kirsten Weide-Zaage, Walter Horaud, Hélène Frémont

Microelectron. Reliab., 2005

2004

How to study delamination in plastic encapsulated devices.

Hélène Frémont, Jean-Yves Delétage, Kirsten Weide-Zaage, Yves Danto

Microelectron. Reliab., 2004