Heinrich Wolf

According to our database, Heinrich Wolf authored at least 6 papers between 2005 and 2009.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2009

Investigating the CDM susceptibility of IC's at package and wafer level by capacitive coupled TLP.

Heinrich Wolf, Horst A. Gieser, Dirk Walter

Microelectron. Reliab., 2009

2006

ESD Susceptibility of Submicron Air Gaps.

Heinrich Wolf, Horst A. Gieser, Detlef Bonfert, Markus Hauser

Microelectron. Reliab., 2006

Transient-induced latch-up test setup for wafer-level and package-level.

Detlef Bonfert, Horst A. Gieser, Heinrich Wolf, M. Frank, A. Konrad, J. Schulz

Microelectron. Reliab., 2006

2005

Capacitively coupled transmission line pulsing cc-TLP--a traceable and reproducible stress method in the CDM-domain.

Heinrich Wolf, Horst A. Gieser, Wolfgang Stadler, Wolfgang Wilkening

Microelectron. Reliab., 2005

A Dedicated TLP Set-Up to Investigate the ESD Robustness of RF Elements and Circuits.

Heinrich Wolf, Horst A. Gieser, Wolfgang Soldner, Harald Gossner

Microelectron. Reliab., 2005

Transient latch-up: experimental analysis and device simulation.

S. Bargstädt-Franke, Wolfgang Stadler, Kai Esmark, Martin Streibl, Krzysztof Domanski, Horst A. Gieser, Heinrich Wolf, Waclaw Bala

Microelectron. Reliab., 2005