Heegon Kim
Orcid: 0000-0003-0728-1346
According to our database1,
Heegon Kim
authored at least 43 papers
between 2012 and 2024.
Collaborative distances:
Collaborative distances:
Timeline
Legend:
Book In proceedings Article PhD thesis Dataset OtherLinks
On csauthors.net:
Bibliography
2024
Proceedings of the NOMS 2024 IEEE Network Operations and Management Symposium, 2024
Proceedings of the NOMS 2024 IEEE Network Operations and Management Symposium, 2024
2023
Network Traffic Prediction and Auto-Scaling of SFC using Temporal Fusion Transformer.
Proceedings of the 24st Asia-Pacific Network Operations and Management Symposium, 2023
2022
Comput. Vis. Image Underst., 2022
Detecting Ripeness of Strawberry and Coordinates of Strawberry Stalk using Deep Learning.
Proceedings of the Thirteenth International Conference on Ubiquitous and Future Networks, 2022
Proceedings of the 23rd Asia-Pacific Network Operations and Management Symposium, 2022
Reinforcement Learning of Graph Neural Networks for Service Function Chaining in Computer Network Management.
Proceedings of the 23rd Asia-Pacific Network Operations and Management Symposium, 2022
2021
IEEE Trans. Netw. Serv. Manag., 2021
Int. J. Netw. Manag., 2021
2020
CoRR, 2020
Proceedings of the 16th International Conference on Network and Service Management, 2020
Proceedings of the 21st Asia-Pacific Network Operations and Management Symposium, 2020
Proceedings of the 21st Asia-Pacific Network Operations and Management Symposium, 2020
Proceedings of the 21st Asia-Pacific Network Operations and Management Symposium, 2020
2019
Machine Learning-Based Method for Prediction of Virtual Network Function Resource Demands.
Proceedings of the 5th IEEE Conference on Network Softwarization, 2019
Proceedings of the 5th IEEE Conference on Network Softwarization, 2019
Proceedings of the IEEE International Conference on Blockchain and Cryptocurrency, 2019
Proceedings of the 15th International Conference on Network and Service Management, 2019
Proceedings of the 20th Asia-Pacific Network Operations and Management Symposium, 2019
Proceedings of the 20th Asia-Pacific Network Operations and Management Symposium, 2019
2018
Design of an On-Silicon-Interposer Passive Equalizer for Next Generation High Bandwidth Memory With Data Rate Up To 8 Gb/s.
IEEE Trans. Circuits Syst. I Regul. Pap., 2018
2017
IEICE Electron. Express, 2017
2016
High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs.
IEEE Des. Test, 2016
2015
Proceedings of the 10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, 2015
Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
Modeling and analysis of defects in through silicon via channel for non-invasive fault isolation.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
Crosstalk-included eye-diagram estimation for high-speed silicon, organic, and glass interposer channels on 2.5D/3D IC.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
2014
IEICE Electron. Express, 2014
Analysis and optimization of a power distribution network in 2.5D IC with glass interposer.
Proceedings of the 2014 International 3D Systems Integration Conference, 2014
Magnetically-coupled current probing structure consisting of TSVs and RDLs in 2.5D and 3D ICs.
Proceedings of the 2014 International 3D Systems Integration Conference, 2014
Fault detection and isolation of multiple defects in through silicon via (TSV) channel.
Proceedings of the 2014 International 3D Systems Integration Conference, 2014
2013
Proceedings of the Mobile, Ubiquitous, and Intelligent Computing, 2013
Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling.
Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013
Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling.
Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013
Proceedings of the 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, 2013
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
2012
Sensors, 2012
Proceedings of the Convergence and Hybrid Information Technology, 2012