Harry Kalargaris

According to our database, Harry Kalargaris authored at least 4 papers between 2014 and 2017.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2017

Voltage scaling for 3-D ICs: When, how, and how much?

Harry Kalargaris, Vasilis F. Pavlidis

Microelectron. J., 2017

STA compatible backend design flow for TSV-based 3-D ICs.

Harry Kalargaris, Yi-Chung Chen, Vasilis F. Pavlidis

Proceedings of the 18th International Symposium on Quality Electronic Design, 2017

Computationally efficient standard-cell FEM-based thermal analysis.

Yi-Chung Chen, Scott Ladenheim, Harry Kalargaris, Milan Mihajlovic, Vasilis F. Pavlidis

Proceedings of the 2017 IEEE/ACM International Conference on Computer-Aided Design, 2017

2014

Interconnect design tradeoffs for silicon and glass interposers.

Harry Kalargaris, Vasilis F. Pavlidis

Proceedings of the IEEE 12th International New Circuits and Systems Conference, 2014