Harold Philipsen
Orcid: 0000-0002-5029-1104
According to our database1,
Harold Philipsen
authored at least 5 papers
between 2009 and 2022.
Collaborative distances:
Collaborative distances:
Timeline
Legend:
Book In proceedings Article PhD thesis Dataset OtherLinks
On csauthors.net:
Bibliography
2022
Proceedings of the IEEE International Memory Workshop, 2022
2015
Proceedings of the IEEE International Reliability Physics Symposium, 2015
2014
Cu seeding using electroless deposition on Ru liner for high aspect ratio through-Si vias.
Proceedings of the 2014 International 3D Systems Integration Conference, 2014
2011
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011
2009
Die stacking using 3D-wafer level packaging copper/polymer through-si via technology and Cu/Sn interconnect bumping.
Proceedings of the IEEE International Conference on 3D System Integration, 2009