Hao-Ping Hong

According to our database, Hao-Ping Hong authored at least 4 papers between 2001 and 2018.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2018

An 87.1% efficiency RF-PA envelope-tracking modulator for 80MHz LTE-Advanced transmitter and 31dBm PA output power for HPUE in 0.153μm CMOS.

Chen-Yen Ho, Shih-Mei Lin, Che-Hao Meng, Hao-Ping Hong, Sheng-Hong Yan, Ting-Hsun Kuo, Chia-Sheng Peng, Chieh-Hsun Hsiao, Hsin-Hung Chen, Da-Wei Sung, Chien-Wei Kuan

Proceedings of the 2018 IEEE International Solid-State Circuits Conference, 2018

2017

A 0.5V BJT-based CMOS thermal sensor in 10-nm FinFET technology.

Da-Shin Lin, Hao-Ping Hong

Proceedings of the IEEE Asian Solid-State Circuits Conference, 2017

2013

An AC-coupled hybrid envelope modulator for HSUPA transmitters with 80% modulator efficiency.

Patrick Riehl, Paul Fowers, Hao-Ping Hong, Michael Ashburn

Proceedings of the 2013 IEEE International Solid-State Circuits Conference, 2013

2001

A reverse-voltage protection circuit for MOSFET power switches.

Hao-Ping Hong, Jiin-Chuan Wu

IEEE J. Solid State Circuits, 2001