Hans Walter

According to our database, Hans Walter authored at least 4 papers between 2010 and 2014.

Collaborative distances:

• Dijkstra number of six.
• Erdős number of five.

2014

Improving the FE simulation of molded packages using warpage measurements.

Saskia Huber, Marius van Dijk, Hans Walter, Olaf Wittler, Tina Thomas, Klaus-Dieter Lang

Microelectron. Reliab., 2014

2013

Transport of moisture at epoxy-SiO₂ interfaces investigated by molecular modeling.

O. Hölck, Jörg Bauer, Tanja Braun, Hans Walter, Olaf Wittler, Bernhard Wunderle, Klaus-Dieter Lang

Microelectron. Reliab., 2013

2010

Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling.

Bernhard Wunderle, E. Dermitzaki, O. Hölck, Jörg Bauer, Hans Walter, Q. Shaik, K. Rätzke, Franz Faupel, Bernd Michel, Herbert Reichl

Microelectron. Reliab., 2010

Novel Packaging Technology for Body Sensor Networks Based on Adhesive Bonding A Low Cost, Mass Producible and High Reliability Solution.

Torsten Linz, Malte von Krshiwoblozki, Hans Walter

Proceedings of the International Conference on Body Sensor Networks, 2010