Hanju Oh

According to our database, Hanju Oh authored at least 2 papers between 2013 and 2015.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2015

Silicon interposer platform with low-loss through-silicon vias using air.

Hanju Oh, Gary S. May, Muhannad S. Bakir

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2013

Within-tier cooling and thermal isolation technologies for heterogeneous 3D ICs.

Yue Zhang, Hanju Oh, Muhannad S. Bakir

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013